EFFECT OF CU ON RESISTIVITY, MICROSTRUCTURE, AND THERMAL PROPERTIES OF SN-3.5AG LEAD-FREE SOLDER ALLOYS

Abstract

Pb solder may be replaced by Sn-Ag-based solder due to its superior mechanical qualities. Using a melt-spinning process for intermediate-step soldering, the Sn-Ag rapidly solidified from the melt in the current investigation to examine the microstructure, thermal, and electrical characteristics of Sn-3.5Ag, Sn-3.5Ag-0.5Cu, and Sn-3.5Ag-0.7Cu. The four-point probe method was used to test the electrical resistivity of Sn–Ag solder alloys at room temperature and between 340K and 600K. Thermal characteristics were examined using Differential Thermal Analysis. When the hardness of as-cast eutectic samples of Sn-3Ag-0.5Cu and Sn-3.5Ag-0.7Cu Lead-Free solder alloys was examined, the Sn-3.5Ag-0.7Cu had the lowest melting point (215°C), while the Sn-3.5 weight percent Ag solder alloy had the highest (221°C). The attributes of the commercially available Sn-3.5 weight percent Ag eutectic solder alloy were compared with the outcomes of the different solder alloys. Additionally shown and addressed are micro-structure investigations.